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1 lead bonding
приєднання виводівEnglish-Ukrainian dictionary of microelectronics > lead bonding
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2 beam-lead bonding
приєднання балкових виводів кристалаEnglish-Ukrainian dictionary of microelectronics > beam-lead bonding
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3 gang (-lead) bonding
групове приєднання виводівEnglish-Ukrainian dictionary of microelectronics > gang (-lead) bonding
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4 gang (-lead) bonding
групове приєднання виводівEnglish-Ukrainian dictionary of microelectronics > gang (-lead) bonding
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5 inner-lead bonding technolog/y
технологія приєднання внутрішніх виводів до кристала на стрічковому носіїEnglish-Ukrainian dictionary of microelectronics > inner-lead bonding technolog/y
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6 bonding
термокомпресійне зварювання; термокомпресія; зварювання; з’єднання, прикріплення (див. т-ж bond, weld, welding) - aluminum bonding
- anodic bonding
- automated tape-carrier bonding
- back bonding
- ball bonding
- batch bonding
- beam-lead bonding
- beam tape-automated bonding
- bird’s-beak bonding
- blind bonding
- bumped tape-automated bonding
- cement bonding
- chip bonding
- chisel bonding
- compliant bonding
- diffused bonding
- diffusion bonding
- electron-beam bonding
- energy-pulse bonding
- eutetic bonding
- face -down bonding
- face bonding
- field-assisted bonding
- flip-chip bonding
- flux-free bonding
- fluxless bonding
- fusion bonding
- gang -lead bonding
- gang bonding
- gold ball bonding
- inboard bonding
- interconnection bonding
- laser bonding
- lead bonding
- nail-head bonding
- silicon fusion bonding
- spider bonding
- stitch bonding
- tape automated bonding (TAB)
- TC bonding
- thermal-pulse bonding
- thermocompression bonding
- thermosonic bonding
- wedge bonding
- wire bonding
- wobble bonding -
7 lead
1. ім. (гнучкий) вивід (корпуса), електродний вивід; провідник 2. дієсл. проводити; виводити - axial lead
- base lead
- beam lead
- bonding lead
- bond lead
- bottom-brazed lead
- buried lead
- butt lead
- cantilevered lead
- collector lead
- compliant lead
- electroformed lead
- gold-plated lead
- guide lead
- gull wing lead
- j- lead
- open j- lead
- overhanging lead
- radial lead
- resilient lead
- ribbon lead
- side-brazed lead
- spider lead
- support lead
- tape-automated-bonded leads -
8 technolog/y
1) технологія (див. т-ж арproach, technique) 2) техніки - advanced technolog/y
- alignment technolog/y
- analog technolog/y
- baseline technolog/y
- basic technolog/y
- batch technolog/y
- beam-tape technolog/y
- bi-FET technolog/y
- bi-MOS technolog/y
- BIMOS technolog/y
- bipolar technolog/y
- bit-slice technolog/y
- beardless technolog/y
- BSA technolog/y
- bubble technolog/y
- bumping technolog/y
- CAD technolog/yies
- CCD technolog/y
- cell array technolog/y
- cermet technolog/y
- CMOS technolog/y
- coating technolog/y
- cryogenic technolog/y
- current technolog/y
- custom-design technolog/y
- deep-ultraviolet photolithographic technolog/y
- dense LSI technolog/y
- diffused epitaxial planar technolog/y
- diffusion technolog/y
- digital technolog/y
- dominant technolog/y
- dry technolog/y
- dry chemical etching technolog/y
- ECL technolog/y
- electron technolog/y
- electron-beam exposure technolog/y
- electron-parts technolog/y
- electro-optical technolog/y
- epibase technolog/y
- epiplanar technolog/y
- epitaxial planar technolog/y
- film-carrier technolog/y
- fine-line technolog/y
- flip-chip bonding technolog/y
- flip-chip technolog/y
- full-slice technolog/y
- fuse-link technolog/y
- fusible-link technolog/y
- gallium arsenide technolog/y
- gate-array technolog/y
- high technolog/y
- high-density technolog/y
- high-electron mobility transistor technolog/y
- “high-end” technolog/y
- high-speed technolog/y
- hybrid technolog/y
- industry-standard MOS technolog/y
- information technolog/y
- inner-lead bonding technolog/y
- integration technolog/y
- interconnection technolog/y
- isoplanar technolog/y
- J-FET technolog/y
- Josephson-junctiontechnolog/y
- Josephsontechnolog/y
- leading-edge technolog/y
- lithographic technolog/y
- logic technolog/y
- low technolog/y
- “low-end” technolog/y
- low-power technolog/y
- magnetic-bubble technolog/y
- mainstream technolog/y
- mask-fabrication technolog/y
- master-slice technolog/y
- merged bipolar technolog/y
- merged technolog/y
- metal-board technolog/y
- metallization technolog/y
- microcircuit technolog/y
- microelectronic technolog/y
- microsystems technolog/y MST
- microsystems technolog/y
- MIS technolog/y
- mixed technolog/y
- monolithic technolog/y
- MOS technolog/y
- MTL technolog/y
- multilayer-wiring technolog/y
- multiple-epitaxial planar technolog/y
- n-channel technolog/y
- optical lithographic technolog/y
- oxide-isolated monolithic technolog/y
- passivation technolog/y
- p-channel technolog/y
- p-channel Si-gate technolog/y
- photofabrication technolog/y
- planar fabrication technolog/y
- planar technolog/y
- plasma technolog/y
- plating technolog/y
- polysilicon-gate technolog/y
- polysilicon-load technolog/y
- polysilicon self-aligned PSA technolog/y
- polysilicon self-aligned technolog/y
- resistless etching technolog/y
- robotic technolog/y
- scaled process technolog/y
- scaled technolog/y
- Schottky transistor logic technolog/y
- Schottky TTL technolog/y
- screen-and-fire technolog/y
- self-aligned source-drain diffusion technolog/y
- shared silicon technolog/y
- silicide-gate technolog/y
- silicon technolog/y
- silicon-gate technolog/y
- silicon-in-insulator technolog/y
- silicon-in-sapphire technolog/y
- silicon-on-insulator technolog/y
- silicon-on-sapphire technolog/y
- silicon wafer technolog/y
- single-diffused planar technolog/y
- single-diffused technolog/y
- solid-state technolog/y
- spider-bonding technolog/y
- standard bipolar technolog/y
- submicron IC technolog/y
- submicron technolog/y
- subnanosecond technolog/y
- substrate technolog/y
- subtractive technolog/y
- superconducting technolog/y
- surface-mount technolog/y
- system technolog/y
- TAB technolog/y
- tape-automated-bonding technolog/y
- tape bumping technolog/y
- thick-film multilayer technolog/y
- thick-film hybrid technolog/y
- thin-film technolog/y
- trench technolog/y
- trench isolation technolog/y
- TTL technolog/y
- ULA technolog/y
- ultraviolet photolithography technolog/y
- unipolar technolog/y
- V-groove technolog/y
- VHSIC technolog/y
- wafer bumping technolog/y
- water treatment technolog/y
- wiring technolog/y
- X-ray technolog/yEnglish-Ukrainian dictionary of microelectronics > technolog/y
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9 bonder
1) устаткування для термокомпресійного зварювання 2) устаткування для монтажу (напр. кристалів на кристалоносії) - beam tape-automated bonding bonder
- beam tape-automated bonder
- BTAB bonder
- bonder die bonder
- flip-chip aligner bonder
- hot gas bonder
- hot-tip bonder
- hybrid die bonder
- hybrid bonder
- inner-lead bonder
- microprocessor-controlled bonder
- nonflame spot bonder
- outer-lead bonder
- pulsed-heat bonder
- spot bonder
- TAB bonder
- tape-automated bonding bonder
- tape-automated bonder
- thermocompression bonder
- thermosonic bonder
- ultrasonic bonder
- wedge bonder
- wire bonder -
10 machine
- axial lead taping machine
- back-end machine
- bending machine
- bonding machine
- byte machine
- cassette-to-cassette machine
- character machine
- charging machine
- component taping machine
- coordinate plotting machine
- data flow machine
- degrutting machine
- deterministic Turing machine
- deterministic machine
- EBL machine
- finite-state machine
- front-end machine
- generalized sequential machine
- gold dotting machine
- high-реrformance machine
- insertion machine
- ion-beam machine
- lapping machine
- lead-forming machine
- limited register machine
- linear sequential machine
- loading machine
- logic simulation machine
- Mealy machine
- molding machine
- Moor machine
- MOS machine
- multiple step-and-repeat machine
- nondeterministic sequential machine
- photocomposition machine
- pick-and-place machine
- pipelined machine
- planar machine
- plasma-etch machine
- plotting machine
- polishing machine
- powder-coating machine
- projection machine
- reference machine
- scribing machine
- sequencing machine
- single step-and-repeat machine
- software-controlled/ machine
- sorting machine
- stack machine
- step-and-repeat machine
- stuffing machine
- transfer molding machine
- transfer machine
- vector-scan electron-beam machine
- welding machine
- wire-routing machine
- wire-wrap machine
- x-y plotting machine -
11 circuit
схема; коло; контур (див. т-ж chip, integration) - air-isolation integrated circuit
- all-diffused circuit
- aluminum-gate MOS circuit
- aluminum-gate circuit
- amplifier integrated circuit
- analog integrated circuit
- AND circuit
- AND-OR circuit
- application specific integrated circuit
- array integrated circuit
- asymmetric-chevron bubble circuit
- asymmetric-chevron circuit
- basic circuit
- beam-leaded integrated circuit
- beam-lead integrated circuit
- bipolar circuit
- bipolar-FET integrated circuit
- breadboard circuit
- built-in self-checking monitoring circuit
- bulk-effect integrated circuit
- catalogue integrated circuit
- ceramic-encapsulated integrated circuit
- charge-coupled device circuit
- charge-coupled circuit
- charge-domain integrated circuit
- charge pumping circuit
- charge-transfer device circuit
- charge-transfer circuit
- chip integrated circuit
- CMOS circuit
- commodity integrated circuit
- common-base circuit
- common-collector circuit
- common-emitter circuit
- compatible integrated circuit
- complementary integrated circuit
- complex integrated circuit
- control integrated circuit
- crosspoint integrated circuit
- current mirror integrated circuit
- custom integrated circuit
- customized integrated circuit
- custom-wired integrated circuit
- Darlington-typecircuit
- Darlingtoncircuit
- dead-on-arrival integrated circuit
- dedicated -design circuit
- dedicated circuit
- depletion-mode integrated circuit
- die integrated circuit
- dielectrically-isolated integrated circuit
- digital integrated circuit
- digital sequential circuit
- diode-array integrated circuit
- discrete-chip integrated circuit
- discrete-component circuit
- discrete Fourier transform integrated circuit
- discrete integrated circuit
- distributed-element equivalent circuit
- domain-originated integrated circuit
- dry-processed integrated circuit
- dual in-line integrated circuit
- ECL circuit
- EFL integrated circuit
- elevated-electrode integrated circuit
- encapsulated integrated circuit
- enchancement-mode integrated circuit
- epitaxial integrated circuit
- epitaxial passivated integrated circuit
- equivalent circuit
- face-down integrated circuit
- fanout-free circuit
- fault-free circuit
- fault-tolerant circuit
- faulty circuit
- field-effect transistor integrated circuit
- field-effect integrated circuit
- field-programmable logic integrated circuit
- film-mounted integrated circuit
- fine-line integrated circuit
- fine-pattern integrated circuit
- flat-pack integrated circuit
- flip-chip integrated circuit
- flip-flop circuit
- front-end circuit
- full-custom integrated circuit
- functional integrated circuit
- gang-bonding integrated circuit
- gate-equivalent circuit
- governor integrated circuit
- guard-ring isolated integrated circuit
- Gunn-effect integrated circuit
- heterointegrated circuit
- high-density integrated circuit
- highly integrated circuit
- high-performance circuit
- high-speed integrated circuit
- high-technology integrated circuit
- high-threshold logic circuit
- high-volume circuit
- home-grown integrated circuit
- homointegrated circuit
- hybrid circuit
- hybrid dielectric integrated circuit
- hybrid film [hybrid-type] circuit
- I2L circuit
- infra-red integrated circuit
- insulated-substrate integrated circuit
- integrated circuit
- interface circuit
- isoplanar-based integrated circuit
- Josephson-junctioncircuit
- Josephsoncircuit
- ion-implanted integrated circuit
- junction isolated integrated circuit
- known-good circuit
- ladder-like circuit
- ladder circuit
- laminated integrated circuit
- large-scale integrated circuit
- leading-edge integrated circuit
- linear integrated circuit
- LOCOS integrated circuit
- logic integrated circuit
- low-noise circuit
- low-profile integrated circuit
- LSI circuit
- lumped-element equivalent circuit
- made-to-order integrated circuit
- master-slice integrated circuit
- matrix integrated circuit
- megascale integrated circuit
- MOSBIP integrated circuit
- memory circuit
- merchant integrated circuit
- merged integrated circuit
- microelectronic circuit
- Micronor integrated circuit
- micron-scale integrated circuit
- microprocessor integrated circuit
- molecular integrated circuit
- monobrid circuit
- monolithic circuit
- MOS-transistor circuit
- MOS circuit
- MSI circuit
- multichip circuit
- multilayer integrated circuit
- multilevel integrated circuit
- multiple-chip circuit
- naked integrated circuit
- NAND circuit
- noise-immunity integrated circuit
- nonredundant integrated circuit
- NOR circuit
- off-the-shelf integrated circuit
- one-chip integrated circuit
- one-mask integrated circuit
- open-collector integrated circuit
- optical integrated circuit
- optoelectronic integrated circuit
- OR circuit
- oxide-isolated integrated circuit
- partially self-checking circuit
- photo-integrated circuit
- photonic integrated circuit
- planar integrated circuit
- planar-mounted integrated circuit
- plastic encapsulated integrated circuit
- plastic integrated circuit
- p-n junction isolated integrated circuit
- polymer thick-film circuit
- prediffused integrated circuit
- programmable integrated circuit
- proprietary integrated circuit
- quick Fourier transform circuit
- race-free circuit
- radiation-hardened integrated circuit
- RС circuit
- redundant integrated circuit
- refreshing circuit
- refresh circuit
- sample-hold circuit
- scaled integrated circuit
- scan design circuit
- schematic circuit
- Schottky TTL integrated circuit
- Schottky TTL circuit
- screen-printed integrated circuit
- sealed-junction integrated circuit
- self-aligned integrated circuit
- self-cased LSI circuit
- self-checking [self-testing] integrated circuit
- semiconductor circuit
- semicustom integrated circuit
- semicustomized integrated circuit
- S/H circuit
- single-chipcircuit
- singlecircuit
- skimming-and-reset circuit
- slice circuit
- small-integration circuit
- smart-power integrated circuit
- SOI integrated circuit
- solid-state integrated circuit
- solid integrated circuit
- SOS integrated circuit
- stacked circuit
- standard сеll-based semicustom integrated circuit
- Strassen algorithm LSI circuit
- stripline integrated circuit
- submicron integrated circuit
- subnanosecond integrated circuit
- superconducting integrated circuit
- superconductor integrated circuit
- surface-mounted integrated circuit
- test-manufactured integrated circuit
- thick-film hybrid integrated circuit
- thick-film integrated circuit
- thin-film hybrid integrated circuit
- thin-film integrated circuit
- three-diffusion integrated
- three-dimensional integrated circuit
- transistor circuit
- tri-mask integrated circuit
- UHSI circuit
- uncommitted integrated circuit
- unipolar integrated circuit
- user specified integrated circuit
- vacuum integrated circuit
- VHSI circuit
- VLSI circuit
- wafer-scale integrated circuit
- wired OR circuit
- 3D integrated circuit -
12 pad
контактний майданчик; стовпчиковий вивід, контактний стовпчик (див. т-ж bump)- bondingpad- bondpad
- chip-bonding chip-connection pad
- chip-connection pad
- conductive pad
- contact pad
- connection pad
- die pad
- electrode pad
- interconnect pad
- I/O pads
- lead-connection pad
- metallized pad
- mounting pad
- polishing pad
- probe contact pad
- support pad
- terminal pad
- test pad
- wiring pad -
13 tape
1) стрічковий носій (вивідних рамок) 2) стрічка - beam tape
- blister tape
- bumped tape
- carrier tape
- checkout tape
- compliant bonding tape
- interconnect tape
- lead tape
- masking tape
- test tape
- transport tape -
14 tool
1) інструмент; пристосування; оснащення (напр. фотошаблону) 2) устаткування; верстат 3) піддавати механічній обробці 4) pl (інструментальні) засоби - antistatic tool
- artwork checking tool
- bonding tool
- CAD tools
- CAE/CAD tools
- computer-aided tool
- computer-aided engeneering tools
- computer-based design tools
- design synthesis tools
- desoldering tool
- diamond scribe tool
- DIP/IC insertion tool
- extraction tool
- hand tool
- insertion tool
- lead-forming tool
- lithography tool
- mask inspection tool
- physical layout tools
- pick-up tool
- placement tool
- process characterization tool
- scribing tool
- software tools
- soldering tool
- sputtering tool
- step-and-repeat tool
- wafer-reading tool
- wire-wrapping tool
- work tool -
15 wire
1. ім. 1) дріт; провідник; шина 2) дріт; (дротяне) з’єднання 2. дієсл. 1)формувати (дротяні) з’єднання; формувати розводку 2) вмонтовувати - bit wire
- bonding wire
- connected wires
- jumper wire
- lead wire
- overflow wires
- quantum wire
- tinned wire
- wrapped wire
См. также в других словарях:
lead bonding — išvadų prijungimas statusas T sritis radioelektronika atitikmenys: angl. lead bonding vok. Anschlußbonden, n rus. присоединение выводов, n pranc. connexion des pattes, f; connexion des sorties, f; connexion des terminaisons, f … Radioelektronikos terminų žodynas
group lead bonding — grupinis išvadų prijungimas statusas T sritis radioelektronika atitikmenys: angl. group lead bonding; mass lead bonding vok. Simultanbonden, n rus. групповое присоединение выводов, n pranc. connexion en groupe, f … Radioelektronikos terminų žodynas
mass lead bonding — grupinis išvadų prijungimas statusas T sritis radioelektronika atitikmenys: angl. group lead bonding; mass lead bonding vok. Simultanbonden, n rus. групповое присоединение выводов, n pranc. connexion en groupe, f … Radioelektronikos terminų žodynas
beam-lead bonding — sijinių išvadų prijungimas statusas T sritis radioelektronika atitikmenys: angl. beam lead bonding; beam lead connection vok. Balkenleiterbonden, n; Balkenleiterverfahren, n rus. присоединение балочных выводов, n pranc. connexion des poutres, f … Radioelektronikos terminų žodynas
chip beam-lead bonding — lustų sijinių išvadų prijungimas statusas T sritis radioelektronika atitikmenys: angl. chip beam lead bonding vok. Bonden von Kristallen mit Balken Anschlüssen, f rus. присоединение кристаллов ИС к балочным выводам, n pranc. connexion poutre puce … Radioelektronikos terminų žodynas
bonding lead — termokompresiškai prijungtas išvadas statusas T sritis radioelektronika atitikmenys: angl. bonding lead vok. Bondanschluß, m rus. вывод, присоединённый методом термокомпрессии, m pranc. broche connectée par soudage à thermocompression, f … Radioelektronikos terminų žodynas
bonding wire lead — termokompresiškai prijungtas vielinis išvadas statusas T sritis radioelektronika atitikmenys: angl. bonding wire lead vok. Bonddrahtanschluß, m rus. проволочный вывод, присоединённый методом термокомпрессии, m pranc. sortie en fil connectée par… … Radioelektronikos terminų žodynas
beam-lead connection — sijinių išvadų prijungimas statusas T sritis radioelektronika atitikmenys: angl. beam lead bonding; beam lead connection vok. Balkenleiterbonden, n; Balkenleiterverfahren, n rus. присоединение балочных выводов, n pranc. connexion des poutres, f … Radioelektronikos terminų žodynas
chemical bonding — ▪ chemistry Introduction any of the interactions that account for the association of atoms into molecules, ions, crystals, and other stable species that make up the familiar substances of the everyday world. When atoms approach one another … Universalium
The Bonding — ST episode name = The Bonding An orphaned boy tries to deal with his mother s death in The Bonding . series = TNG ep num = 53 prod num = 153 date = October 23, 1989 writer = Ronald D. Moore director = Winrich Kolbe guest = Colm Meaney Gabriel… … Wikipedia
outer-lead thermal-compression bonding — termokompresinis išorinių išvadų prijungimas statusas T sritis radioelektronika atitikmenys: angl. outer lead thermal compression bonding vok. Außenbonden, n rus. термокомпрессионное присоединение внешних выводов, n pranc. connexion à… … Radioelektronikos terminų žodynas